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Dual-in-Line

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Dual-in-Line (DIL or DIP) packages - the most common through-hole IC packages. Package has two parallel rows of pins extending perpendicularly out of a quad or rectangular metal housing. "Flat" Dual-in-Line headers have single piece flat base, that requires a volume type lid. ATGD "Flat" Dual-in-Line headers are available with a welding projection for lid mounting.

Box-like Dual-in-Line (DIPS) packages, volume type with  "walls". ATGUBD Unibody Package has  two parallel rows of pins extending perpendicularly out of a quad or rectangular metal housing. Additionally there are solutions with base plate for optimized mounting. The package if optimized for flat lid type.

ATGD -  "Flat" Dual-in-Line Headers

ATGUDB - UNIBODY Dual-in-Line