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HIGH QUALITY HYBRID AND MICROELECTRONICS PACKAGES

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MICROWAVE PACKAGES

FIBER OPTICS PACKAGES

TEC Microsystems offers a wide range of ATG standard design configurations and product styles with the ability to infinitely customize each design to your specifications. From prototype to production, TEC Microsystems and ATG provide  the industry’s fastest turnaround. ATG also has an extensive inventory of raw material that can be quickly configured to your specific requirements. We invite you to explore our product offerings and contact us for any questions regarding your latest project.


Quality is at the core of our production process. We pride ourselves on providing reliable glass to meal seal solutions and achieve this through  100% in-process inspection, certified raw material suppliers, and ISO-9001:2008 compliance.

Transistor Outlines (TO) are classic packages that are  being used in many today’s applications. Wide stock of raw material is available with have very quick turnaround times on standard sizes and layouts.

Flatpackage (FP) - rectangular or square packages with leads parallel to base plane attached on two opposing sides of the package periphery. Widely used for Integrated Circuits (IC) in many industrial applications.

Dual-in-Line (DIL or DIP) packages - the most common through-hole IC packages. Package has two parallel rows of pins extending perpendicularly out of a quad or rectangular metal housing.

Packages that operate at higher frequencies and are available in a wide range of sizes and configurations.

These packages are a subgroup of the Dual-in-Line header family of packages. They typically have fewer pins in specific standard locations and may have have special plating requirements.

These packages serve the needs of customers from the fiber optic industry. The solutions are based on Flatpacks or Dual-in-Line package equipped with a fiber output. Various configurations are available.