Transistor Outline package term (or "TO-style" abbreviature) has been used for quite a long time in electronics industry. The term comes from JEDEC - the industrial standard for the design and dimensions of various microelectronic packages. The TO header provides an industry standard mechanical base and pins layouts for the installation of electronic components in various application areas - semiconductor lasers, simple electronic circuits, photodetectors, IR- and X-Ray detectors and many other.
Classical TO-8 style header has usually 6 to 16pins (optional types with 20pins are available), the base is made from Kovar (ASTM F-15 alloy) or CRS (Cold Rolled Steel). Additionally central screw can be attached to the base for header mounting. TO-8 headers have around 8 x 8mm2 space for for components mounting. Pins can be standard flat or modified with pin ends flattening or nail-head configuration to simplify wire bonding (WB) process.
TEC Microsystems provides various standard header configurations, available usually from stock, or development and manufacturing in accordance to Customer blueprint and configuration requirements.
STANDARD SOLUTIONS (EXAMPLES)